Cooling Solutions for Embedded PC
With the increasing demand for performance on X86 architecture based single board computers and computer modules the heat dissipation concept becomes more and more complex. Many applications require reliable computing under high temperature conditions (-40°C to 85°C), but the challenge is to keep the CPU / chipset temperature within the specified range. Having only a small temperature delta for compensation, huge heat sinks are required in order to move the heat away from the CPU. When it comes to closed systems without any airflow it gets even worse.
Our target is to offer almost all our products for usage within this temperature range and we can verify and guarantee the reliability under these conditions. For this purpose we create and use specific test equipment. Typically we offer heat spreader solutions that are developed and validated for usage under extended temperature conditions. However, for some products a sufficient heat sink would exceed the outline dimensions of the computer module by far, and in these cases it is impossible to offer a standard, off-the-shelf heat sink solution with the product. We publish this note to make you aware that for any CPU system with more than approx. 15W system power consumption a standard heat sink solution may not be available and a dedicated cooling concept is mandatory. The configuration of the solution depends on many different factors which are very much depending on your overall system. Some factors are the air flow, other components creating additional heat, space constraints etc.
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